Principal Package Competence Engineer

Overview

In this role, you drive advanced packaging solutions for Power MOSFET products, serving as a technical authority across design, assembly, and industrialization. You guide technology strategies, collaborate with product groups and sites, and shape the packaging roadmap to maintain leadership. You will lead projects, validate new concepts, and mentor engineers, delivering impactful, patentable innovations. This position offers a chance to influence high-profile initiatives within a global packaging ecosystem.

Pay / Benefits

• competitive base salary
• Annual Incentive Plan
• pension scheme
• visa sponsorship and relocation assistance
• hybrid working policy
• health & wellbeing programs

Responsibilities

• Lead package design studies and development for new and existing semiconductor products
• Serve as an expert in semiconductor packaging and assembly technologies
• Evaluate emerging package and process technologies to maintain technology leadership
• Support validation of new package concepts through simulation and technical studies
• Contribute to package strategy development and long-term technology roadmaps
• Act as a key technical interface between Business Groups and assembly manufacturing sites
• Provide expert support on package development, assembly processes, and industrialization activities
• Lead technical projects related to package development, qualification, and process freeze activities
• Mentor and develop junior engineers while promoting knowledge sharing across the organization
• Generate innovative package concepts and contribute to patentable ideas and future technology developments
• Lead high-profile technical initiatives aligned with strategic business objectives

Key requirements

• PhD with 5+ years of industry experience, or Bachelor’s/Master’s degree with 8+ years of relevant semiconductor experience
• Extensive experience in semiconductor packaging and assembly technologies
• Experience in power semiconductor technologies and applications
• Proven track record of package innovation, technology development, or patent generation
• Experience supporting global manufacturing and assembly organizations
• Customer-facing experience and participation in technical discussions with external stakeholders
• Strong understanding of semiconductor package materials, assembly processes, and reliability requirements
• Experience with failure analysis, reliability testing, and root-cause investigations
• Expertise in design of experiments (DOE), data analysis, and technical problem solving
• Experience using advanced package design and simulation tools
• Strong technical documentation and technical presentation skills
• Ability to lead technical teams and influence stakeholders across multiple functions

• leadership and people management
• cross-functional collaboration
• effective communication with external stakeholders
• semiconductor packaging and assembly technologies
• power semiconductor technologies and applications
• package design and simulation tools

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